News

PCB High And Low Temperature Reliability Testing: Verification Of Board Life Under Thermal Stress
PCB High And Low Temperature Reliability Testing: Verification Of Board Life Under Thermal Stress

Temperature is the primary environmental factor affecting PCB reliability, from extremely cold outdoors in minus tens of degrees to high temperature inside the equipment at hundreds of degrees, the PCB is always in a stress environment of thermal expansion and contraction.

2026/04/03
READ MORE
PCB Pad Solderability Failure Analysis: From Defect Location To Root Cause Cracking
PCB Pad Solderability Failure Analysis: From Defect Location To Root Cause Cracking

In PCBA production, poor solderability of solder pads is the primary cause of soldering defects, commonly manifested as non-wetting, semi-wetting, solder shrinkage, poor solder penetration, pinholes and bubbles, cold soldering and false soldering, etc.

2026/04/03
READ MORE
Get the latest price? We'll respond as soon as possible(within 12 hours)
This field is required
This field is required
Required and valid email address
This field is required
This field is required
For a better browsing experience, we recommend that you use Chrome, Firefox, Safari and Edge browsers.