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Consumer electronics are developing towards miniaturization and high integration. The PCBA SMT mounting process is facing severe challenges: the size of components is evolving from 0402 package to 01005 package (0.4mm×0.2mm), and the mounting accuracy requirement is raised to ±30μm
The EMI issue of high-speed PCBS (typically referring to PCBS with signal frequencies exceeding 100 MHZ or rising edges less than 1ns) is indeed more difficult to troubleshoot, as high-frequency signals have stronger radiation capabilities and are prone to problems such as transmission line effects and crosstalk.