High Volume PCBA Circuit Board Assembly with Gerber File
SZH operate a fully self-owned production base equipped with multiple high-precision SMT lines, complemented by DIP, testing, and assembly lines. This enables flexible production from prototyping to large-scale PCB assembly.
High-Precision SMT Lines: Support 01005 components, 0.3mm pitch BGA, QFN, and other fine-pitch package assembly.
Full-Process Coverage: Including double-sided SMT, mixed assembly, selective soldering, and press-fit technology.
Rigorous Quality Control: Full-process inspection with SPI, AOI, X-Ray, functional testing, and aging test systems.
- SZH
- China
- Information
1. Product Overview
Professional High-Volume PCBA Mainboard Manufacturing Solution
We provide a one-stop PCBA manufacturing service, from Gerber files to finished assembly, specializing in high-volume, high-precision, and high-reliability circuit board assemblies. With advanced production equipment and a stringent quality control system, we are equipped to meet the large-scale production demands of industrial, commercial, and consumer electronics sectors.
2. Core Advantages
High-Volume Manufacturing Capability
Daily Output Capacity: Up to 50,000+ boards per day, supporting ultra-large volume orders.
Rapid Delivery: Standard lead time of 10-15 days; expedited service reduces it to 7 days.
Scalable Production: Multiple SMT lines operate simultaneously to ensure stable supply.
Professional Gerber File Processing
Format Compatibility: Supports all major Gerber formats (RS-274X, ODB++, IPC-2581, etc.).
Engineering Review: Free DFM (Design for Manufacturability) analysis to optimize design and reduce costs.
Fast Ramp-Up: Seamless transition from files to production, minimizing preparation time.
Quality Assurance System
International Certifications: ISO 9001:2015 Quality Management System, ISO 14001 Environmental Management.
Comprehensive Testing: Full coverage with AOI (Automated Optical Inspection), X-Ray inspection, and Functional Testing.
High Yield Rate: Mass production yield consistently exceeds 99.5%.
3. Technical Specifications
Basic Parameters
| Item | Specification |
|---|---|
| Board Layers | 1-24 layers, supporting HDI (High-Density Interconnect) |
| Substrate Material | FR-4, Aluminum Base, High-Frequency Materials (e.g., Rogers) |
| Min. Trace Width/Space | 3mil / 3mil (0.076mm) |
| Surface Finish | HASL (Lead/Lead-Free), Immersion Gold (ENIG), Immersion Silver, OSP |
| Soldering Process | Fully Automated SMT Assembly + Selective Wave Soldering |
Component Support Capability
Component Sizes: From 0201, 01005 micro components to large BGAs, QFNs.
IC Packaging: BGA (0.3mm pitch), CSP, POP, SiP.
Special Components: Connectors, shielding cans, irregularly shaped components.
4. Service Workflow
File Submission → Upload Gerber files and BOM.
Engineering Review → Free DFM analysis and process optimization feedback (within 24 hours).
Quotation Confirmation → Transparent pricing, no hidden costs.
Prototype Validation → Small-batch trial production and testing (optional).
Mass Production → High-efficiency production on fully automated lines.
Quality Control → Multiple inspection stages ensure quality.
Packaging & Shipping → Anti-static packaging, global logistics support.
5. Quality Control System
Four-Tier Inspection Assurance
Incoming Material Inspection: All components undergo strict inspection with full traceability.
Process Control: Real-time SMT process monitoring with CPK (Process Capability Index) analysis.
Automated Inspection:
AOI (precision: ±0.025mm)
X-Ray Inspection (for BGA solder joint analysis)
SPI (Solder Paste Inspection, 3D measurement)
Functional Testing: Customized test fixtures ensure full functionality of every board.
6. Application Fields
Consumer Electronics: Smart home devices, wearables, entertainment systems.
Industrial Control: PLC controllers, industrial automation equipment, sensor modules.
Communication Devices: Routers, switches, 5G modules, base station equipment.
Automotive Electronics: Infotainment systems, ADAS control modules, automotive sensors.
Medical Devices: Monitoring equipment, diagnostic instruments, portable medical devices.
IoT Devices: Smart terminals, gateway devices, data acquisition modules.
7. Frequently Asked Questions (FAQ)
Q1: What is the minimum order quantity (MOQ)?
A: The MOQ for mass production is 500 pieces. We also support small-batch prototyping for verification.
Q2: What files are required for Gerber-based assembly?
A: Complete Gerber files, BOM (Bill of Materials), centroid/placement file, and assembly drawings. Our engineers will assist in reviewing file completeness.
Q3: How do you ensure consistency in high-volume production?
A: We utilize fully automated lines with SPC (Statistical Process Control), monitoring critical process parameters in real-time to ensure batch-to-batch stability.
Q4: Do you offer component sourcing services?
A: Yes, we provide turnkey supply chain services, sourcing components from authorized distributors to ensure genuine parts.
Q5: How is the lead time calculated?
A: Standard lead time is 10-15 days after file confirmation, depending on board complexity and order volume. Expedited production services are available.
8. Why Choose Us?
✅ 16+ years of PCBA manufacturing experience, serving 2000+ global clients.
✅ Vertically integrated supply chain for cost control and reliable delivery.
✅ Technical team support, providing end-to-end consultation from design to production.
✅ Flexible production scheduling, supporting split deliveries and inventory management.
✅ Comprehensive after-sales service, offering 12-month quality warranty and ongoing technical support.
9. Request a Quote
Submit your project requirements for a customized quotation:
Upload your Gerber files and technical documents.
Specify your expected volume and delivery timeline.
Receive a detailed quote and production plan.
Schedule a trial production slot.
