PCBA with AOI (Automated Optical Inspection) & X-Ray Inspection
SZH operate a fully self-owned production base equipped with multiple high-precision SMT lines, complemented by DIP, testing, and assembly lines. This enables flexible production from prototyping to large-scale PCB assembly.
High-Precision SMT Lines: Support 01005 components, 0.3mm pitch BGA, QFN, and other fine-pitch package assembly.
Full-Process Coverage: Including double-sided SMT, mixed assembly, selective soldering, and press-fit technology.
Rigorous Quality Control: Full-process inspection with SPI, AOI, X-Ray, functional testing, and aging test systems.
- SZH
- China
- Information
Product Overview
High-Precision, High-Reliability PCBA Mainboard
Incorporating advanced Automated Optical Inspection (AOI) and X-Ray inspection technologies, each mainboard guarantees industrial-grade excellence in soldering accuracy, component placement, and internal structure. Ideal for demanding applications such as smart devices, industrial controls, and medical instruments, it provides a stable and reliable core hardware foundation for your products.
Core Technology: Dual-Inspection Assurance
1. AOI Automated Optical Inspection
Precise Soldering Inspection: Utilizes high-definition cameras and intelligent algorithms to automatically identify soldering defects (e.g., cold joints, short circuits, misalignment).
Component Placement Verification: Checks component position, polarity, and part number accuracy, ensuring placement precision ≥99.9%.
Real-Time Feedback & Optimization: Inspection data is synchronized in real-time with the production system for closed-loop process control.
2. X-Ray Non-Destructive Inspection
Internal Structure Visualization: Provides 3D imaging for hidden solder joints (e.g., BGA, QFN), eliminating concealed defects.
Multilayer PCB Analysis: Precisely inspects internal trace connectivity, via wall integrity, and layer-to-layer alignment.
Material Integrity Verification: Detects micro-defects such as internal component cracks or voids.
Technical Specifications
| Parameter | Specification |
|---|---|
| Board Material | FR-4 / High-Frequency / Aluminum Base (Customizable) |
| Maximum Layers | 1-20 Layers |
| Min. Line Width/Space | 0.05mm / 0.05mm |
| Surface Finish | ENIG, HASL, OSP, Immersion Silver |
| Soldering Technology | Lead-Free, RoHS Compliant |
| Inspection Coverage | 100% AOI Full Inspection + Targeted X-Ray Inspection |
Application Fields
Industrial Control: PLCs, Industrial PCs, Sensor Modules
Medical Devices: Patient Monitors, Diagnostic Equipment, Portable Medical Devices
Consumer Electronics: Smart Home, IoT Terminals, High-End Audio
Automotive Electronics: Vehicle Control Systems, EV BMS
Communication Equipment: 5G Modules, Routers, Base Station Units
Key Advantages
Zero-Defect Oriented: Dual-inspection technology reduces potential failure rates to ≤0.01%.
Long-Term Reliability: Precision engineering ensures stable performance under extreme temperature and humidity conditions.
Rapid Delivery: Automated inspection enhances production efficiency, supporting flexible small-to-medium batch customization.
Full Traceability: Each board includes an inspection report, with data traceable to production batch.
Quality Control Process
Design Verification → Strict Component Sourcing → SMT Assembly → 100% AOI Inspection → Targeted X-Ray Inspection → Functional Testing → Aging Test → Final QC
Every step complies with ISO9001 & IPC-A-610 standards, with optional professional reliability testing (e.g., vibration, thermal cycling).
Request a Custom Solution
We offer free technical consultation and prototyping services!
If you have specific requirements (e.g., impedance control, military-grade reliability), please contact our engineering team for a tailored solution.
Precision Inspected, Reliability Assured
Choosing us means choosing an unwavering commitment to quality. Let every PCBA mainboard be the solid foundation for your product's success.
