Custom Embedded System PCBA Design and Low-Volume Manufacturing
SZH operate a fully self-owned production base equipped with multiple high-precision SMT lines, complemented by DIP, testing, and assembly lines. This enables flexible production from prototyping to large-scale PCB assembly.
High-Precision SMT Lines: Support 01005 components, 0.3mm pitch BGA, QFN, and other fine-pitch package assembly.
Full-Process Coverage: Including double-sided SMT, mixed assembly, selective soldering, and press-fit technology.
Rigorous Quality Control: Full-process inspection with SPI, AOI, X-Ray, functional testing, and aging test systems.
- SZH
- China
- Information
1. Core Value
An End-to-End PCBA Solution Engineered for Innovative Hardware
We transform your concepts into reliable, functional hardware. From initial architecture to finished board, our integrated service for custom embedded system design and low-volume manufacturing bridges the gap between prototype and production seamlessly.
2. Technical Capabilities
Expert Design Engineering
Custom Architecture Design: Optimized systems based on ARM, x86, RISC-V, and other platforms tailored to your application.
High-Speed Signal Integrity: Expert design and analysis for DDR4/5, PCIe 4.0/5.0, and high-speed SerDes interfaces.
Mixed-Signal Design: Co-design of sensitive analog and digital circuits for optimal signal purity and performance.
Power System Optimization: Multi-domain power management with efficiency up to 95%, meeting stringent power requirements.
Thermal & Reliability Analysis: Advanced thermal management solutions and MTBF calculations for long-term stability.
Low-Volume Manufacturing Excellence
Flexible Low-Volume Production: Economical manufacturing runs from 10 to 10,000 units.
Multi-Material Expertise: FR-4, high-frequency Rogers, flexible PCBs, and more.
Advanced Assembly: 01005 micro-components, fine-pitch BGAs (0.35mm), QFN, PoP, and other complex packages.
Complex Multi-layer Boards: Up to 24-layer HDI (High-Density Interconnect) manufacturing.
Rigorous Quality Control: Full suite including AOI, X-Ray inspection, and ICT.
3. Application Solutions
Industry-Specific Applications
Industrial IoT: Edge computing gateways, sensor hubs, equipment monitoring modules.
Medical Devices: Portable diagnostic equipment, patient monitoring systems, medical imaging pre-processors.
Consumer Electronics: Smart home controllers, wearable device core boards, specialized interactive devices.
Automotive Electronics: Telematics control units, ADAS modules, in-vehicle infotainment systems.
Communications: Dedicated protocol converters, network edge nodes, specialized radio modules.
Ideal Project Types
Functional Prototypes & Proof-of-Concept Boards
Pilot Pre-Production Runs
Replacement/Upgrade Modules for Professional Equipment
Specialized Hardware for Niche Markets
R&D Iterations and Development Kits
4. Our Collaborative Process
Four-Phase Engagement Model
Discovery & Planning
Initial consultation and feasibility review.
System architecture proposal and BOM cost analysis.
Project timeline and milestone definition.
Design & Development
Schematic capture, simulation, and verification.
PCB layout, routing, and signal/power integrity analysis.
Prototype fabrication, assembly, and debug support.
Basic firmware/driver framework development.
Manufacturing & Validation
Design for Manufacturability (DFM) review and optimization.
Component procurement and supply chain management.
Low-volume production with comprehensive testing.
Environmental stress screening and reliability validation.
Delivery & Support
Complete technical documentation package.
Quality report for the production batch.
Seamless scale-up support for future volumes.
Optional long-term lifecycle management.
5. Quality Assurance
Three-Tier Quality Control
Design Verification: DFM/DFA, thermal simulation, SI/PI analysis.
Process Control: Incoming, in-process, and final inspection.
Product Validation: Functional, performance, environmental, and burn-in testing.
6. Why Partner With Us
Key Differentiators
Deep Collaboration: Direct engineer-to-engineer communication.
Transparent Process: Real-time project tracking with client sign-off at key stages.
Cost-Optimized Design: Balancing performance with manufacturing economics from day one.
Design for Evolution: Hardware versioning strategy to streamline future upgrades.
Our Commitment
First prototype design within 15 business days.
Iterative design revisions (within scope) at no extra cost.
Full transparency in component sourcing.
99% first-pass yield for low-volume production.
7. Technical Specifications Overview
| Capability | Range |
|---|---|
| PCB Layers | 1-24 layers (HDI capable) |
| Min. Trace/Space | 3/3 mil |
| Min. Hole Size | 0.15mm (mechanical), 0.1mm (laser) |
| Surface Finish | ENIG, Immersion Tin/Silver, OSP, Gold Fingers |
| Component Size | 01005, 0201, 0402, etc. |
| BGA Pitch | Down to 0.35mm |
| Assembly Process | Leaded/Lead-Free Reflow, Selective Soldering, Hand Soldering |
| Testing | Flying Probe, ICT, Functional Test, Boundary Scan |
8. Start Your Project
Request a Custom Quote
Please provide the following for a preliminary assessment within 24 hours:
Target functionality and key specifications.
Board size constraints and interface requirements.
Operational environment (temperature, humidity, etc.).
Target cost range and estimated annual volumes.
Project timeline and key milestones.
Contact Our Engineering Team
Ready to guide your hardware innovation from vision to reality.
