End-to-End Electronics Manufacturing from PCB Fab to PCBA

SZH operate a fully self-owned production base equipped with multiple high-precision SMT lines, complemented by DIP, testing, and assembly lines. This enables flexible production from prototyping to large-scale PCB assembly.
High-Precision SMT Lines: Support 01005 components, 0.3mm pitch BGA, QFN, and other fine-pitch package assembly.
Full-Process Coverage: Including double-sided SMT, mixed assembly, selective soldering, and press-fit technology.
Rigorous Quality Control: Full-process inspection with SPI, AOI, X-Ray, functional testing, and aging test systems.

  • SZH
  • China
  • Information

1. Core Value Proposition: One-Stop PCBA Solution

We provide end-to-end electronics manufacturing services—from PCB design and prototyping to full-scale PCBA assembly—freeing you from managing multiple suppliers and enabling you to focus on product innovation and market expansion. Whether it's complex mainboards, embedded systems, or IoT devices, we deliver high-quality, efficient end-to-end manufacturing solutions.

2. End-to-End Manufacturing Process

1. PCB Design & Engineering Support

  • Expert Design Review: Our engineering team provides DFM (Design for Manufacturability) analysis to optimize your design for reliability and cost efficiency

  • Rapid Prototyping: Supports various PCB types (rigid, flexible, rigid-flex)

  • Multilayer Expertise: Capable of handling up to 20-layer high-density interconnect (HDI) mainboards

2. PCB Fabrication Capabilities

  • Material Selection: FR-4, high-frequency materials (Rogers, Taconic), metal-core substrates, and more

  • Advanced Processes: Laser drilling, blind/buried vias, ENIG/Immersion Tin surface finishes

  • Quality Control: AOI (Automated Optical Inspection), impedance control testing, flying probe testing

3. PCBA Assembly Services

  • Component Procurement & Management: Global supply chain network, BOM optimization, and component alternates

  • Advanced Placement Technology:

    • High-speed SMT placement (0402/0201 micro components)

    • Mixed technology (SMT + THT)

    • Precision BGA/CSP/QFN assembly (0.3mm pitch)

  • Soldering Processes: Reflow soldering, selective soldering, wave soldering

4. Quality Control & Testing

StageTesting MethodStandard/Accuracy
Incoming InspectionComponent verification, XRF analysisIPC-A-610 Class 2/3
Process ControlSPI solder paste inspection, AOI10μm detection accuracy
Functional TestingICT, flying probe, functional test (FCT)100% coverage
Reliability TestingEnvironmental stress screening, burn-in, thermal cyclingMIL-STD-883

5. Application Areas

Industrial Electronics

  • Industrial control mainboards

  • Automation equipment controllers

  • Motor drive boards

Consumer Electronics

  • IoT device mainboards

  • Smart home controllers

  • Portable electronic products

Communication Equipment

  • Network device mainboards

  • RF modules

  • Base station control boards

Medical Electronics

  • Medical monitoring device mainboards

  • Diagnostic instrument control boards

6. Service Advantages

End-to-End Transparency

  • Real-Time Progress Tracking: Monitor project status anytime via customer portal

  • Data Sharing: Inspection reports and image records at each manufacturing stage

  • Flexible Communication: Dedicated project manager support with regular updates

Cost & Efficiency Optimization

  • Integrated Supply Chain: Bulk purchasing discounts passed to customers

  • Fast Turnaround: Standard PCB in 5-7 days, PCBA assembly in 7-10 days

  • Flexible Order Sizes: From small-batch prototypes to mass production (10–100,000+ units)

Technical Support & Assurance

  • Technical Consulting: Free upfront manufacturability analysis

  • IP Protection: Strict NDA agreements and confidentiality measures

  • After-Sales Support: Rapid response and resolution for quality issues

7. Technical Specifications Summary

ItemCapability Range
PCB Layers1–20 layers
Min. Trace/Space3/3 mil
Min. Hole Size0.15mm
PCB DimensionsMin. 10×10mm, Max. 500×600mm
Component Sizes0201 micro components to large connectors
Placement Accuracy±0.025mm
Soldering ProcessLead-free, RoHS compliant

8. Customer Collaboration Process

  1. Requirement Assessment: Provide BOM, Gerber files, and specifications

  2. Proposal & Quotation: Detailed quote and manufacturing plan within 24 hours

  3. Engineering Confirmation: DFM analysis and design optimization recommendations

  4. Prototype Build: Rapid prototyping and testing validation

  5. Volume Production: On-demand manufacturing with quality control

  6. Logistics & Delivery: Global shipping with on-time delivery


Request a Custom Quote Now: Upload your design files, and our engineers will provide a tailored manufacturing solution with detailed pricing within 24 hours. Accelerate your product time-to-market with our professional end-to-end manufacturing service!


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